Material: FR4

Board thickness: 0.6MM

Number of layers: 6L 1/H/H/H/H1

Single chip size: 18.70*16.02MM

Connection size: 100.02*91.82MM/20PCS

Surface technology: Immersion gold

BGA: 0.15MM

Hole density: 260,000

Minimum aperture: 0.10MM

Minimum line width and distance: 0.10/0.10MM

Solder mask: green Number of test points: estimated 1650 points

Drilling hole: through hole