Conventional process - Shenzhen Meiji Circuit Technology Co., Ltd.

PCB Conventional process FPC Flexible board SMT、PCBA HDI difficulty board

Double-sided Immersion Gold Green Oil
product description:Material quality: FR-4Board thickness: 1.0MMNumber of layers: 2L 1/1OZSingle chi...
Four-layer Immersion Gold Black Oil
product description:Material quality: FR-4Board thickness: 0.8MMNumber of floors: 4LCopper thickness...
Double-sided Immersion Gold Black Oil
Material quality: FR-4Board thickness: 0.8MMNumber of layers: 2L 1/1OZSingle chip size: 15.42*70.43M...
Four-layer Immersion Gold Blue Oil
Material quality: FR-4Board thickness: 0.6MMNumber of layers: 4L 1//H/H1OZSingle chip size: 20.65*68...
Double-sided + impedance lead-free tin spray blue oil
Material quality: FR-4Board thickness: 1.2MMNumber of layers: 2L 1/1OZSingle chip size: 124.51*31.32...
HDI first-order semi-orifice plate Immersion gold green oil
Material: FR4Board thickness: 0.6MMNumber of layers: 6L 1/H/H/H/H1Single chip size: 18.70*16.02MMCon...
Eight-layer HDI motherboard+BGA+impedance, heavy gold, green oil
Material quality: FR-4Board thickness: 1.6MMNumber of layers: 8L 1/H/H/H/H/H/H/1OZSingle chip size: ...
10-layer HDI motherboard + blind buried via + BGA + impedance, gold, green oil
Material quality: FR-4Board thickness: 1.6MMNumber of layers: 10L 1/H/H/H/H/H/H/H/H/1OZSingle chip s...
Four-layer soft and hard board, Immersion gold, green oil
Material quality: FR-4 + FPC (with glue electrolysis)Board thickness: 1.2MM (the overall thickness o...
Four-layer combination of soft and hard, gold, green oil
Material quality: FR-4Board thickness: 1.2MM (the overall thickness of the finished product), FPC th...
Flexible and hard wiring board, Immersion gold, Green oil/covering film
Material quality: FR-4 + FPC (with glue electrolysis)Board thickness: 1.5MM (the overall thickness o...
Four-layer soft and hard board, immersion gold, black oil/covering film
Material quality: FR-4Board thickness: 1.0MM (the overall thickness of the finished product), FPC th...
Four layers of soft and hard combination Immersion gold Green oil/covering film
Material quality: FR-4Board thickness: 1.2MM (the overall thickness of the finished product), FPC th...
Ten layers of HDI second order + blind buried via + BGA + impedance + immersion gold green oil
Material quality: FR-4Board thickness: 1.6MMNumber of layers: 10L 1/H/H/H/H/H/H/H/H/1OZSingle chip s...
Eight-layer HDI second-order blind buried vias between each layer Immersion gold black oil
Material quality: FR-4Board thickness: 1.0MMNumber of layers: 8 H/H/H/H/H/H/H/HSingle chip size: 28....

首页 1 2 3 4 5 6 下一页尾页

HOME

ABOUT US

Products

PROCESS

NEWS

CONTACT

Chinese

Double-sided Immersion Gold Green Oil

Four-layer Immersion Gold Black Oil

Double-sided Immersion Gold Black Oil

Four-layer Immersion Gold Blue Oil

Double-sided + impedance lead-free tin spray blue oil

HDI first-order semi-orifice plate Immersion gold green oil

Eight-layer HDI motherboard+BGA+impedance, heavy gold, green oil

10-layer HDI motherboard + blind buried via + BGA + impedance, gold, green oil

Four-layer soft and hard board, Immersion gold, green oil

Four-layer combination of soft and hard, gold, green oil

Flexible and hard wiring board, Immersion gold, Green oil/covering film

Four-layer soft and hard board, immersion gold, black oil/covering film

Four layers of soft and hard combination Immersion gold Green oil/covering film

Ten layers of HDI second order + blind buried via + BGA + impedance + immersion gold green oil

Eight-layer HDI second-order blind buried vias between each layer Immersion gold black oil

ABOUT US

Products

PROCESS

contact us