Material quality: FR-4

Board thickness: 0.8MM

Number of layers: 2L 1/1OZ

Single chip size: 15.42*70.43MM

Connection size: 119.80*80.43MM/7PCS

Surface technology: Immersion gold 35%

Hole density: 160,000 line width and line spacing: 0.12/0.10

Solder mask: black on both sides Test points: estimated 1020 points

Drilling hole: through hole