Material quality: FR-4
Board thickness: 1.2MM
Number of layers: 2L 1/1OZ
Single chip size: 91.08*67.10MM
Connection size: 101.66*205.18MM/3PCS
Surface technology: lead-free tin spray
Hole density: 120,000 Line width and line spacing: 0.125/0.125MM Minimum hole: 0.2MM
Solder mask: double-sided green test points: estimated 1020 points
Drilling hole: through hole
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