Material quality: FR-4

Board thickness: 0.6MM

Number of layers: 4L 1//H/H1OZ

Single chip size: 20.65*68.77MM

Connection size: 79.05*134.66MM/6PCS

Surface technology: Immersion gold 35%

Hole density: 80,000 Line width and line spacing: 0.12/0.10 Minimum hole: 0.15MM

Solder mask: blue Number of test points: estimated 580 points

Drilling hole: through hole