product description:

Material quality: FR-4

Board thickness: 0.8MM

Number of floors: 4L

Copper thickness: 1/0.5/0.5/1OZ

Single chip size: 15.30*65.35MM

Connection size: 140.6*101.8MM/12PCS

Surface technology: Immersion gold 35%

Hole density: 190,000

Line width and distance: 0.12/0.10 MM

Minimum distance from hole to line: 0.11MM

Solder mask: black

Test points: estimated 1220 points

Drilling hole: through hole