product description:

Material quality: FR-4

Board thickness: 1.0MM

Number of layers: 2L 1/1OZ

Single chip size: 57.80*76.05MM

Contiguous film size: 154.18*126.03MM

Surface technology: Immersion gold 35%

Hole density: 160,000 line width and line spacing: 0.12/0.10

Solder mask: double-sided green

Minimum aperture: 0.2MM

Minimum line width and distance: 0.125MM

Minimum distance from hole to line: 0.13MM

Test points: Estimated 1620 points

Drilling hole: through hole