Material quality: FR-4

Board thickness: 1.6MM

Number of layers: 10L 1/H/H/H/H/H/H/H/H/1OZ

Single chip size: 49.93*70.07MM

Connection size: 90.10*102.11MM/2PCS

Surface technology: Immersion gold 45% BGA: 0.20MM (BGA has clamping line)

Hole density: 360,000 Minimum aperture: 0.15MM Line width and distance: 0.075/0.075MM

Solder mask: green Number of test points: estimated 4800 points

Drilling hole: blind burying between layers