Material quality: FR-4

Board thickness: 1.0MM

Number of layers: 8 H/H/H/H/H/H/H/H

Single chip size: 28.954*11.138

Joint size: 128.3*116.86 Surface technology: Immersion gold 25% 18%

Density 1.5 million Line width and line spacing: 0.10/0.10 BGA pad 0.20 without wire clamping

Solder mask: double-sided black solder mask Test points: estimated 12,000 points

Drill hole:

1-2 blind hole 0.127

1-3 blind hole 0.127

1-4 blind hole 0.127

1-5 blind hole 0.127

2-3 Buried hole 0.127

2-4 Buried hole 0.127

2-5 Buried hole 0.127

3-4 Buried hole 0.127

3-5 Buried hole 0.127

4-5 Buried hole 0.127

5-6 Buried hole 0.127

6-7 Buried hole 0.127

5-6 blind hole 0.127

8-7 blind hole 0.127

8-6 blind hole 0.127

8-5 blind hole 0.127

1-8 through holes 0.381