Material quality: FR-4

Board thickness: 1.2MM (the overall thickness of the finished product), FPC thickness: 0.20MM

Number of layers: 4L 1/H/H/1OZ

Single chip size: 47.15*105.42MM

Connection size: 130.41*214.31MM/4PCS

Surface technology: Immersion gold 30%

Hole density: 100,000 Minimum aperture: 0.25MM Minimum line width and line spacing: 0.10/0.10MM (FPC line width)

Solder mask: green oil/covering film Number of test points: estimated 890 points

Drilling hole: soft and hard combined through hole