Material quality: FR-4

Board thickness: 1.0MM (the overall thickness of the finished product), FPC thickness: 0.25MM

Number of layers: 4L 1/H/H/1OZ

Single chip size: 783.93*41.31MM

Connection size: 110.24*164.50MM/3PCS

Surface technology: Immersion gold 40%

Hole density: 80,000 Minimum aperture: 0.25MM Minimum line width and line spacing: 0.075/0.075MM (FPC line width)

Solder mask: black oil/covering film Number of test points: estimated 530 points

Drilling hole: soft and hard combined through hole