Material quality: FR-4 + FPC (with glue electrolysis)

Board thickness: 1.5MM (the overall thickness of the finished product), FPC thickness: 0.3MM

Number of layers: 4L 1/H/H/1OZ

Single chip size: 768.80*33.68MM

Connection size: 768.80*33.68MM/1PCS

Surface technology: Immersion gold 10%

Hole density: 520 Minimum aperture: 0.25MM Minimum line width and line spacing: 0.075/0.075MM (FPC line width)

Solder mask: PCB (green) + FPC (yellow cover film)

Drilling hole: soft and hard combined through hole