Material quality: FR-4

Board thickness: 1.2MM (the overall thickness of the finished product), FPC thickness: 0.20MM

Number of layers: 4L 1/H/H/1OZ

Single chip size: 55.92*100.13MM

Connection size: 114.43*199.70MM/4PCS

Surface technology: Immersion gold 45%

Hole density: 180,000 Minimum aperture: 0.30MM Minimum line width and line spacing: 0.10/0.10MM (FPC line width)

Solder mask: green Number of test points: estimated 2800 points

Drilling hole: soft and hard combined through hole