Shenzhen Meiji Circuit Technology Co., Ltd.
bai
 
 
PCB Conventional processFPC Flexible boardSMT、PCBAHDI difficulty board
Four-layer soft and hard board, Immersion gold, green oil

Material quality: FR-4 + FPC (with glue electrolysis)

Board thickness: 1.2MM (the overall thickness of the finished product), FPC thickness: 0.25MM

Number of layers: 4L 1/H/H/1OZ

Single chip size: 34.60*48.09MM

Connection size: 34.60*48.09MM/1PCS

Surface technology: Immersion gold 30%

Hole density: 890 Minimum aperture: 0.25MM Minimum line width and line spacing: 0.075/0.075MM (FPC line width)

Solder mask: PCB (green) + FPC (yellow cover film)

Drilling hole: soft and hard combined through hole

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