Material quality: FR-4 + FPC (with glue electrolysis)
Board thickness: 1.2MM (the overall thickness of the finished product), FPC thickness: 0.25MM
Number of layers: 4L 1/H/H/1OZ
Single chip size: 34.60*48.09MM
Connection size: 34.60*48.09MM/1PCS
Surface technology: Immersion gold 30%
Hole density: 890 Minimum aperture: 0.25MM Minimum line width and line spacing: 0.075/0.075MM (FPC line width)
Solder mask: PCB (green) + FPC (yellow cover film)
Drilling hole: soft and hard combined through hole
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