Material quality: FR-4

Board thickness: 1.6MM

Number of layers: 10L 1/H/H/H/H/H/H/H/H/1OZ

Single chip size: 78.02*79.62MM

Connection size: 78.02*79.62MM/1PCS

Surface technology: Immersion gold 38% BGA: 0.20MM

Hole density: 160,000 Minimum aperture: 0.15MM Line width and line spacing: 0.075/0.075MM (BGA has clamped lines)

Solder mask: double-sided green test points: estimated 3200 points

Drilling hole: any layer interconnection between 10 layers, blind and buried holes intersect