Material quality: FR-4

Board thickness: 1.6MM

Number of layers: 8L 1/H/H/H/H/H/H/1OZ

Single chip size: 74.02*105.04MM

Connection size: 74.02*105.04MM/1PCS

Surface technology: Immersion gold 55% BGA: 0.25MM

Hole density: 290,000 Minimum aperture: 0.15MM Line width and line spacing: 0.075/0.075MM (BGA has clamped lines)

Solder mask: double-sided green test points: estimated 2800 points

Drilling hole: Blind and buried holes intersect between 8 layers