Normal PCB production flow chart:

Single panel process

Cutting→drilling→printing circuit→gold plating on the whole board→etching→inspection→printing solder mask→spraying tin→printing characters→forming→finished product inspection→over rosin→packing

Double panel spray tin plate process

Cutting → drilling → copper sinking → board electrical (thickened copper) → graphics transfer → electrical copper and electric tin → etching tin removal → inspection → printed solder mask → printed characters → spray tin → forming → testing → finished product inspection → packaging

Double-sided nickel-gold plating process

Cutting → drilling → copper sinking → board electrical (thickened copper) → graphics transfer → electro-nickel electro-gold → film removal and etching → inspection → printed solder mask → printed characters → forming → testing → finished product inspection → packaging

Multi-layer board tin spraying process flow

Cutting → inner layer circuit → inner layer etching → inner layer inspection → blackening (browning) → lamination → shooting → drilling → board electricity (thick copper) → pattern transfer (outer layer) → electric copper electric tin → Etching tin removal → inspection → printing solder mask → printing characters → spray tin → forming → testing → finished product inspection → packaging

Multilayer board gold finger + spray tin board process

Cutting → inner layer circuit → inner layer etching → inner layer inspection → blackening (browning) → lamination → shooting → drilling → board electricity (thick copper) → pattern transfer (outer layer) → electric copper electric tin → Etching tin removal→inspection→printing solder mask→printing characters→electric gold finger→spraying tin→forming→testing→finished product inspection→packaging

Process flow of nickel-gold plating on multi-layer boards

Cutting → inner layer line → inner layer etching → inner layer inspection → blackening (browning) → lamination → shooting → drilling → copper immersion → board electricity (thick copper) → pattern transfer (outer layer) → electric nickel Electroplating → film removal and etching → inspection → solder mask printing → printing characters → forming → testing → finished product inspection → packaging

Multi-layer plate immersion nickel gold plate process cutting material → inner layer line → inner layer etching → inner layer inspection → blackening (browning) → lamination → shooting → drilling → copper sinking → board electricity (thickened copper) → Graphic transfer (outer layer)→electric copper and electric tin→etching tin removal→inspection→printing solder mask→chemical immersion of nickel and gold→printing characters→forming→testing→finished product inspection→packaging