The production of flexible circuit boards (FPC or FPC) is definitely a technical activity. In production, it includes the following processes. Different manufacturers have different levels of processes according to their strengths and technical skills.

Surface treatment: Immersion gold (also known as chemical gold), anti-oxidation (OSP), gold plating, spray tin, tin plating

Shape processing: manual shape, CNC (numerical control machine) cutting, laser cutting, die

Substrate copper thickness: 1/3 ounce, 1/2 ounce, 1 ounce, 2 ounces, 4 ounces

Line width and line spacing: the narrowest 0.065mm